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1

A theory of pad conditioning for chemical-mechanical polishing

Leonard J. Borucki, Thomas Witelski, Colin Please, Peter R. Kramer, Donald Schwendeman

Journal:

Journal of Engineering Mathematics

Year:

2004

Language:

english

File:

PDF, 428 KB

english, 2004

2

Pad Topography, Contact Area and Hydrodynamic Lubrication in Chemical-Mechanical Polishing

Borucki, Leonard John, Sun, Ting, Zhuang, Yun, Slutz, David, Philipossian, Ara

Journal:

MRS Proceedings

Year:

2009

Language:

english

File:

PDF, 1.35 MB

english, 2009

3

Fluid Pressures and Pad Topography in Chemical Mechanical Polishing

Borucki, Leonard J., Ng, Sum Huan, Danyluk, Steven

Journal:

Journal of The Electrochemical Society

Year:

2005

Language:

english

File:

PDF, 839 KB

english, 2005

4

Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications

Yasa Sampurno, Leonard Borucki, Yun Zhuang, Sudhanshu Misra, Karey Holland, Duane Boning, Ara Philipossian

Journal:

Thin Solid Films

Year:

2009

Language:

english

File:

PDF, 723 KB

english, 2009

5

Topography simulation for the virtual wafer fab

Timothy S. Cale, Tushar P. Merchant, Leonard J. Borucki, Andrew H. Labun

Journal:

Thin Solid Films

Year:

2000

Language:

english

File:

PDF, 1.05 MB

english, 2000

6

Multiple scale integrated modeling of deposition processes

Tushar P Merchant, Matthias K Gobbert, Timothy S Cale, Leonard J Borucki

Journal:

Thin Solid Films

Year:

2000

Language:

english

File:

PDF, 288 KB

english, 2000

7

ECS Transactions [ECS China Semiconductor Technology International Conference 2010 (CSTIC 2010) - Shanghai, China (March 18 - March 19, 2010)] - Effect of Pad Micro-Texture on Frictional Force, Removal Rate, and Wafer Topography during Copper CMP Process

Zhuang, Yun, Liao, Xiaoyan, Borucki, Leonard J., Theng, Siannie, Wei, Xiaomin, Ashizawa, Toranosuke, Philipossian, Ara

Year:

2010

Language:

english

File:

PDF, 834 KB

english, 2010

8

Investigation of Diamond Grit Size and Conditioning Force Effect on CMP Pads Topography

Sun, Ting, Borucki, Leonard, Zhuang, Yun, Philipossian, Ara

Journal:

MRS Proceedings

Year:

2007

Language:

english

File:

PDF, 245 KB

english, 2007

9

Tribological, Thermal, and Wear Characteristics of Poly(phenylene sulfide) and Polyetheretherketone Retaining Rings in Interlayer Dielectric CMP

Wei, Xiaomin, Zhuang, Yun, Sampurno, Yasa, Sudargho, Fransisca, Wargo, Christopher, Borucki, Leonard, Philipossian, Ara

Journal:

Electrochemical and Solid-State Letters

Year:

2010

Language:

english

File:

PDF, 860 KB

english, 2010

10

Analyses of Diamond Disk Substrate Wear and Diamond Microwear in Copper Chemical Mechanical Planarization Process

Meled, Anand, Zhuang, Yun, Wei, Xiaomin, Cheng, Jiang, Sampurno, Yasa Adi, Borucki, Leonard, Moinpour, Mansour, Hooper, Don, Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

2010

Language:

english

File:

PDF, 985 KB

english, 2010

11

Defects and Diffusion in Al and Al-Cu Alloy

Liu, Chun Li, Liu, Xiang Yang, Borucki, Leonard J.

Journal:

Defect and Diffusion Forum

Year:

2001

Language:

english

File:

PDF, 388 KB

english, 2001

12

Experimental Investigation and Numerical Simulation of Pad Stain Formation during Copper CMP

Lee, Hyosang, Zhuang, Yun, Borucki, Leonard, O'Moore, Fergal, Joh, Sooyun, Philipossian, Ara

Journal:

MRS Proceedings

Year:

2007

Language:

english

File:

PDF, 222 KB

english, 2007

13

Effect of pad surface micro-texture on dishing and erosion during shallow trench isolation chemical mechanical planarization

Liao, Xiaoyan, Zhuang, Yun, Borucki, Leonard J., Cheng, Jiang, Theng, Siannie, Ashizawa, Toranosuke, Philipossian, Ara

Journal:

Japanese Journal of Applied Physics

Year:

2014

Language:

english

File:

PDF, 1.46 MB

english, 2014

14

CMP Active Diamond Characterization and Conditioner Wear

Borucki, Leonard, Zhuang, Rumin, Zhuang, Yun, Philipossian, Ara, Rikita, Naoki

Journal:

MRS Proceedings

Year:

2007

Language:

english

File:

PDF, 363 KB

english, 2007

15

Effect of Slurry Injection Position on Slurry Mixing, Friction, Removal Rate, and Temperature in Copper CMP

Sampurno, Yasa, Borucki, Leonard, Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

2005

Language:

english

File:

PDF, 723 KB

english, 2005

16

A Method for Direct Measurement of Substrate Temperature during Copper CMP

Sampurno, Yasa A., Borucki, Leonard, Zhuang, Yun, Boning, Duane, Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

2005

Language:

english

File:

PDF, 1.11 MB

english, 2005

17

Analysis of A Novel Slurry Injection System in Chemical Mechanical Planarization

Meled, Anand, Zhuang, Yun, Sampurno, Yasa Adi, Theng, Siannie, Jiao, Yubo, Borucki, Leonard, Philipossian, Ara

Journal:

Japanese Journal of Applied Physics

Year:

2011

Language:

english

File:

PDF, 746 KB

english, 2011

18

Effect of Pad Surface Micro-Texture on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization Process

Liao, Xiaoyan, Zhuang, Yun, Borucki, Leonard J., Cheng, Jiang, Theng, Siannie, Ashizawa, Toranosuke, Philipossian, Ara

Journal:

Japanese Journal of Applied Physics

Year:

2013

Language:

english

File:

PDF, 82 KB

english, 2013

19

Experimental and Numerical Analysis of An Inhibitor-Containing Slurry for Copper Chemical Mechanical Planarization

Zhuang, Yun, Li, Zhonglin, Shimazu, Yoshitomo, Uotani, Nobuo, Borucki, Leonard, Philipossian, Ara

Journal:

Japanese Journal of Applied Physics

Year:

2005

Language:

english

File:

PDF, 1.21 MB

english, 2005

20

Theoretical and Experimental Investigation of Conditioner Design Factors on Tribology and Removal Rate in Copper Chemical Mechanical Planarization

Borucki, Leonard, Lee, Hyosang, Zhuang, Yun, Nikita, Naoki, Kikuma, Ryozo, Philipossian, Ara

Journal:

Japanese Journal of Applied Physics

Year:

2009

Language:

english

File:

PDF, 420 KB

english, 2009

21

Analysis of Formation of Pad Stains in Copper Chemical Mechanical Planarization

Lee, Hyosang, Borucki, Leonard, Zhuang, Yun, Joh, Sooyun, O'Moore, Fergal, Philipossian, Ara

Journal:

Japanese Journal of Applied Physics

Year:

2009

Language:

english

File:

PDF, 739 KB

english, 2009

22

[IEEE 2014 International Conference on Planarization/CMP Technology (ICPT) - Kobe, Japan (2014.11.19-2014.11.21)] Proceedings of International Conference on Planarization/CMP Technology 2014 - Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP

Zhuang, Yun, Sampurno, Yasa, Borucki, Leonard, Philipossian, Ara

Year:

2014

Language:

english

File:

PDF, 620 KB

english, 2014

23

Mean Residence Time and Dispersion Number Associated with Slurry Injection Methods in Chemical Mechanical Planarization

Mu, Yan, Han, Rouchen, Sampurno, Yasa, Zhuang, Yun, Borucki, Leonard, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2016

Language:

english

File:

PDF, 666 KB

english, 2016

24

Revisiting the Removal Rate Model for Oxide CMP

Sorooshian, Jamshid, Borucki, Leonard, Stein, David, Timon, Robert, Hetherington, Dale, Philipossian, Ara

Journal:

Journal of Tribology

Year:

2005

Language:

english

File:

PDF, 1.22 MB

english, 2005

25

Effect of Conditioning and Slurry Application Method on Silicon Dioxide Removal Rates Using a Ceria-Based Chemical Mechanical Planarization Slurry

Han, Ruochen, Sampurno, Yasa, Bahr, Matthew, Borucki, Leonard, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2017

Language:

english

File:

PDF, 773 KB

english, 2017

26

Effect of Slurry Injection System Position on Removal Rate for Shallow Trench Isolation Chemical Mechanical Planarization Using a Cerium Dioxide Slurry

Bahr, Matthew, Sampurno, Yasa, Han, Ruochen, Skillman, Morgan, Borucki, Leonard, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2017

Language:

english

File:

PDF, 963 KB

english, 2017

27

Effect of Various Slurry Injection System Configurations on Removal Rates of Silicon Dioxide Using a Ceria-Based Chemical Mechanical Planarization Slurry

Han, Ruochen, Sampurno, Yasa, Bahr, Matthew, Skillman, Morgan, Borucki, Leonard, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2017

Language:

english

File:

PDF, 645 KB

english, 2017

28

Effect of CVD-Coated Diamond Discs on Pad Surface Micro-Texture and Polish Performance in Copper CMP

Stuffle, Calliandra, Han, Ruochen, Sampurno, Yasa, Slutz, David, Theng, Siannie, Borucki, Leonard, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2018

Language:

english

File:

PDF, 1.02 MB

english, 2018

29

Effect of Conditioning Downforce and Pad Break-In Time on Pad Surface Micro-Texture

McAllister, Jeffrey, Stuffle, Calliandra, Sampurno, Yasa, Hetherington, Dale, Suarez, Jon Sierra, Borucki, Leonard, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2018

Language:

english

File:

PDF, 1.13 MB

english, 2018

30

Effect of Conditioner Type and Downforce, and Pad Break-In Time, on Pad Surface Micro-Texture in Chemical Mechanical Planarization

McAllister, Jeffrey, Stuffle, Calliandra, Sampurno, Yasa, Hetherington, Dale, Suarez, Jon Sierra, Borucki, Leonard, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2018

Language:

english

File:

PDF, 3.30 MB

english, 2018

31

Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In

Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.97 MB

english, 2019

32

Insights into Tungsten Chemical Mechanical Planarization: Part II. Effect of Pad Surface Micro-Texture on Frictional, Thermal and Kinetic Aspects of the Process

Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.10 MB

english, 2019

33

Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In

Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

File:

PDF, 1.97 MB

2019

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